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Embedded Board and Service for Mission-Critical Applications
Rugged X Reliable X Expertise Services
DESIGN-IN SERVICE FOR RUGGEDIZED APPLICATION
  • Component Selection
    & Control
    Certified components & suppliers for environments with wide temperature & humidity
    • 2011/65/EU RoHS
    • 1907/2006 REACH
  • Design
    Quality
    Strict layout design & process check
    • IPC-4101
    • IPC-A-610G Class 2 & 3
  • Wide
    Temperature
    Thermal simulation and validation. 100% testing in chamber before shipping
    • IEC60068-2
    • MIL-STD-810G
  • Anti-Shock/
    Vibration
    External mechanical fixing for key parts; corner bonding for main chip
    • IEC60068-2-64
    • MIL-STD-810G
  • Conformal
    Coating
    Automatic coating process and visual inspection
    • MIL-I-46058C
  • Manufacturing
    Capability
    Advanced manufacturing process in electronics assembly industries
    • ISO9001 & ISO14001
    • IPC-A-610G Class 2 & 3
COMPUTER ON MODULE
  • SMARC - SOM-2569
    • Intel Celeron processor
    • Soldered memory
    • Wireless connectivity
  • COMe Mini - SOM-7569
    • Intel Atom processor
    • Soldered memory & eMMC
    • TPM 2.0 secured
  • COMe Basic - SOM-9590
    • Intel Xeon processor
    • Soldered memory & SSD
    • MIL-STD 810G
  • RTX - ROM-3420
    • NXP i.MX6 Dual processor
    • Soldered memory & eMMC
    • Wide range power input 5-24V
EMBEDDED SINGLE BOARD
  • Pico-ITX - MIO-2361
    • Intel Atom processor
    • Onboard LPDDR4 & eMMC
    • Dual GbE, HDMI, HSUART, TPM
    • DC-in 12/24V, -40~85°C
  • 3.5” SBC - MIO-5850
    • Intel Celeron processor
    • Onboard DDR3L & eMMC
    • 3 GbE, VGA, HSUART, CANBus, TPM
    • DC-in 12~24V, -40~85°C
  • 3.5” SBC - MIO-5373
    • Intel 8th gen. Core processor
    • Triple Displays, NVMe Storage
    • Dual GbE, USB3.2, CANBus, TPM
    • DC-in 12~24V, -40~85°C
  • 3.5” SBC - RSB-4411
    • NXP i.MX 6 processor
    • On-board DDR3 & eMMC
    • HDMI, VGA & Dual-LVDS
    • M.2 & mini-PCIe support
INDUSTRIAL-GRADE PERIPHERAL
  • SODIMM - SQR-YD4
    • DDR4 2666 with mounting holes
    • MIL-810G military level shock verified
    • -40~85ºC
  • 2.5 SSD - SQF-C25 920
    • U.2 2.5" NVMe SSD up to 7.6TB
    • Advanced thermal solution
    • -40~85ºC
  • Mini PCIe - EWM-C117F
    • Reliable connection throughput
    • For US/EU/JP/Taiwan
    • -40~85ºC
  • M.2 - EWM-W195M201E
    • Reliable connection throughput
    • WEP 64-bit & 128-bit encryption
    • -40~85ºC
How does Advantech meet your harsh indoor & outdoor needs?
Advantech ruggedized board is the ideal choice for customers looking for flexible I/O and 24/7 reliability. Advantech’s products can operate in a wide temperature ranges and adheres to exacting standards from design to production. Advantech’s selection features solutions for extreme environments and harsh outdoor applications.
  • Hardware Design
    • Component selection
    • Quality thermal design
    • Laboratory tested
    • High vibration tolerance
    • BIOS and TPM secured
  • Embedded Software
    • Remote hardware monitoring and control
    • Vertical I.Apps and WISE-PaaS Marketplace
    • AIM-Linux and Windows
  • Manufacturing Capability
    • Phoenix: 100% temperature screening
    • Phoebus: natively extended temperature with ORT
    • 100% test and inspection
  • Add-on Services
    • Conformal coating
    • Corner bonding
    • Anti-sulfur materials
    • Extended longevity supports
    • MIL-STD 810G/IPC-A 610G Class 3 certifications
Learn More about Embedded Design-in Service
CASE STUDY
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