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Home Boards & Cards Embedded Single Board Computers 3.5" Single Board Computers By Processor Qualcomm QSC6490 Processor

MIO-5355Q6Z-U7A1U Qualcomm QCS6490, 3.5" SBC, UFS 128G, -20~70, TW

Qualcomm QCS6490, 3.5" SBC, UFS 128G, -20~70, TW
  • Qualcomm QCS6490, 3.5" SBC, UFS 128G, -20~70, TW
  • Qualcomm QCS6490, 3.5" SBC, UFS 128G, -20~70, TW
  • Qualcomm QCS6490, 3.5" SBC, UFS 128G, -20~70, TW
  • Qualcomm QCS6490, 3.5" SBC, UFS 128G, -20~70, TW

  1. Qualcomm® QCS6490/QCS5430 on 3.5" SBC, support extend operating temperature -20~70°C
  2. Powerful but Low Power with 8x Kryo 670 CPU from 1.9 up to 2.7 GHz + Adreno GPU 643 + up to 12.3 TOPs iNPU
  3. Rugged Design with On-board 8GB LPDDR5 and 128GB UFS or eMMC
  4. Flexible Displays with HDMI and LVDS or eDP & Rich I/Os: 2x GbE, 6x USB, 4x COM, 2x MIPI-CSI, 1x Audio
  5. 3x M.2 Expansions: M.2 E-Key 2230 for WiFi/BT, M.2 B-Key 3052 for 4G/LTE, M.2 B-Key 2280 for NVMe Storage
  6. Various OS Support: Yocto BSP, Windows on Arm and Ubuntu
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2 years extended warranty
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Specifications
Category
Attribute
Value
Display
Dual Display
HDMI+LVDS
Display
HDMI
1 x HDMI2.0, up to 4096 x 2160
Display
LCD
LVDS: Dual channel 18/24-bit, up to 1920 x 1080
Memory
Max. Capacity
up to 8 GB
Memory
Technology
LPDDR5
Processor
Core Number
8
Processor
CPU
Qualcomm Dragonwing™ QCS6490
Processor
Max Turbo Frequency
2.7GHz
Storage
eMMC
Up to 128GB
Storage
UFS
Up to 128GB
Environment
Humidity
Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
Environment
Operating Temperature
Standard: 0 ~ 60 °C (32 ~ 140 °F) ; Extend: -20~70 °C (-4~158 °F) with 0.7m/s airflow
Environment
Storage Temperature
- 40 ~ 85° C (-40 ~185° F)
Environment
Vibration Resistance
3.5 Grms
Power
Connector
ATX 2x2p
Power
Power Management
AT, ATX
Power
Power Supply Voltage
12V ± 10%
Ethernet
Controller
LAN1/LAN2: RTL8211FS
Ethernet
Speed
10/100/1000 Mbps
Graphics
GPU
Adreno™ 643
Graphics
Max. Frequency
1.25 GHz
Certification
EMC
CE, FCC
Expansion
M.2 B-Key
1 x B-Key 2280, 1 x B-Key 3052 with Nano-SIM
Expansion
M.2 E-Key
1 x E-Key 2230
Mechanical
Dimensions
146 x 102 mm (5.75" x 4.02")
Internal I/O
Front Panel Control
Power-on, Reset, Power LED
Internal I/O
GPIO
8-bit general purpose input/output
Internal I/O
I2C
2
Internal I/O
Inverter
1
Internal I/O
Serial
COM1/2 RS232/422/485, COM3/4 RS232 with auto flow control (ESD protection: air gap ±15kV, contact ±8kV)
Internal I/O
USB
2 x USB3.0
Rear I/O
Audio
1 (Line-Out, Mic-In)
Rear I/O
Ethernet
2
Rear I/O
HDMI
1
Rear I/O
USB 2.0
2
Rear I/O
USB 3.0
2
AI Engine
Clock Speed
1.45 GHz
AI Engine
NPU
Hexagon™ 770

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