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Accelerate Edge Evolution with
Server-Grade Performance
Edge computing plays a key role in embedded IoT networks. Rising demands for computing power are pushing these solutions to the next generation. The new edge solutions require powerful computing capabilities, high bandwidth transmission, and information security. Advantech integrates embedded platforms with these featured technologies to help customers build reliable IoT Solutions.
  • MASS DATA
     PROCESSING
    Streaming data aggregate, analysis and transfer
  • HIGH NETWORK
     BANDWIDTH
    Reduce Data Transmission Time
  • SCALABILITY & EASY
     DEPLOYMENT
    Modularized Design for Quick Expandability
  • REMOTE
     MANAGEMENT
    Easy Accessibility and Operation
  • LOW
     LATENCY
    Time-Sensitive Communication
FEATURED TECHNOLOGIES
  • Server-Grade
     Processor
    Extreme high performance and multi-stream computing
    • Intel® Xeon® up to 16cores
    • Up to 256GB DDR4
  • High Bandwidth
     Connectivity
    Super speed data throughput with low latency transmission
    • Up to 25 Gb Ethernet
    • PCI Express Gen4
    • USB4™
  • Advanced
     Security
    Highly integrated data encryption and security features
    • Boot Guard
    • Secure Boot
    • TPM 2.0
    • Intel® TME, SGX & TXT
  • Remote Edge
     Management
    System control, monitoring and OTA software update
    • SUSI API & Utility
    • BIOS OTA update
    • WISE-DeviceOn
    • IPMI (OOB)
  • Compact Form
     Factor
    Fast integration, better scalability and easy maintenance
    • COM Express & COM-HPC
    • Industrial motherboard mini-ITX
  • Rugged &
     Reliable
    Rugged design principles to ensure system stability in harsh environment
    • -40 ~ 85 °C (-40 ~ 185 °F) operating temp.
    • Anti-vibration: 7.7Grm
    • Memory down / screwed Rugged SODIMM
INDUSTRIAL MOTHERBOARDS
Micro-ATX
Mini-ITX
  • Micro-ATX
    AIMB-585
    • Intel® Xeon® E3 Processor
    • Dual GbE LAN, triple display
    • mPCIe for mSATA, WiFi module
    • Software RAID 0, 1, 5, 10, TPM (optional)
  • Micro-ATX
    AIMB-586
    • Intel® Xeon® E Processor
    • PCIe x16 slot
    • Four GbE LAN
    • ATX or 12V DC-in power
  • Micro-ATX
    AIMB-587
    • Intel® Xeon® W Processor
    • Dual 10GbE & Dual GbE LANs
    • M.2 M-Key for SSD
    • Up to 16 USB ports
  • Mini-ITX
    AIMB-290
    • Intel® Atom® C3000 processor
    • Dual 10GbE & Dual GbE LANs
    • ATX or 12V DC-in power
    • IPMI 2.0
COMPUTER ON MODULE
Type 6
Type 7
  • Type 6
    SOM-5899
    • 9th Gen. Intel® Xeon® E Processor
    • Intel UHD P630 GPU
    • 96GB DDR4 SODIMM
    • 1 PEG gen3 x16 & 8 PCIe gen3 x1
  • Type 6
    SOM-5962
    • Intel® Atom® C3000 Processor
    • 16Core, 128GB DDR4 SODIMM
    • Quad 10GBASE-KR & 1GbE
    • Rugged SODIMM, max. 64GB
  • Type 6
    SOM-5992/5993
    • Intel® Xeon® D Processor
    • 16Core, 128GB DDR4 SODIMM
    • Up to Quad 10GBASE-KR
    • 32 lanes PCIe up to gen4 speed
  • Type 7
    SOM-9590
    • Intel® Xeon® D Processor
    • 16Core, 16GB DDR4 memory down
    • Onboard TPM2.0, SSD storage
    • MIL-STD-810G compliance
COM-HPC
Boost Performance With COM-HPC :
Join the Computer-on-Module Evolution
 
Advantech Evaluation Kit
  • 16C/110W processor
  • 512GB memory with 8pcs 288pin DIMM
  • 45 lanes PCIe gen3 expansion
  • 4 ports 10GBASE-KR & 1 port 1000BASE-T
  • Pinout: COM-HPC Server type
  • Size E 200 x 160 mm (7.87 x 6.29 in)
Overview
Advantech’s COM-HPC is a evolutionary computer on module with excellent CPU performance. It features Super Speed interfaces, diverse pin definitions, a selection of board sizes, and brand new connectors. COM-HPC is aimed at complementing the full spectrum of COM express modules to meet performance demands for next generation edge computing solutions.
  • Server Pinout : board size D & E. Headless design and 25GBASE-KR with 4~8pcs DIMM
  • Client Pinout : board size A,B & C. Provides graphics and NBASE-T with 2~4pcs SODIMM
INDUSTRIAL PERIPHERALS
SQFlash
SQRAM
Windows
  • SQFlash
    SQF-CM8 920 series
    • PCIe Gen.3 x4, M.2 2280 NVMe SSD, upto 2TB
    • Read/Write performance up to 3400/ 2700 MB/sec
    • AES-256 & TCG-OPAL support, included LDCP & RAID ECC
    • Support SQ Manager/DeviceON
  • SQFlash
    SQF-S25 840 series
    • SATA 6Gb/s, 2.5” SATA SSD, upto 8TB
    • AES-256 & TCG-OPAL support, includes LDCP & RAID ECC
    • Support SQ Manager/DeviceON
  • SQRAM
    SQR-SD4(ECC)
    • SODIMM DDR4 with ECC function support
    • Outstanding speed 3200MHz
    • High capacity up to 32GB
    • Support temperature monitoring
  • Windows
    Windows Server IoT 2019
    • Enhanced security capabilities
    • Unprecedented hyper-converged infrastructure
    • Improved container for faster application building
    Windows SQL Server IoT 2019
    • Azure Machine Learning and Spark ML
    • Intelligent database
    • Encrypted with Secure Enclaves
Quadro Flow Cooling Solution
Slim, quiet, and powerful design features advanced high-efficiency cooling solution to enable extreme computing performance.
  • 100% CPU Power
  • Silent Operation
  • Thin & Light
  • Easy Assembl
Learn More
Advanced Manufacturing Process
Improving product quality by IPC-A-610G Class 3 certification.
  • Strict layout design & quality check
  • 100% function check and visual inspection
  • Ability of IPC-A-610G class 3 manufacturing
Learn More
Wide Temperature Operation Services
Learn More
Multi-Layer Security Solutions
Effectively protect your solutions from devices to the cloud
  • Secure, backup, and recover software solutions
  • Centralized IoT device security management
  • Multi-function BIOS with security and boot management
Learn More
Anti-Vibration Solution & Service
MIL-STD-810 anti-vibration design, reliability enhancements, and strict verification
  • Key component soldiering, corner bonding capabilities.
  • Adhere to MIL-STD-810 test procedures
  • Optimized mechanical design and custom service
Learn More
Learn More about Embedded Design-in Service
APPLICATIONS
  • Diagnostic
     Imaging
    • PCI Express x16 slot
    • Intel® Xeon® CPU
    • ESD Level 4
  • 5G Micro
     Cell Station
    • Up to 16-core CPU
    • Dual 10 Gigabit Ethernet
    • Up to 512 GB memory
  • Surveillanc
    • Four 10GbE LAN
    • AI-enabled Video Analytics
    • Virtual RAID on CPU
  • Outdoor Mobile
     Server
    • CPU, RAM and storage soldered down
    • 10GBASE-KR
    • T ambient: -40 ~ 85 °C
  • High Speed
     Test Equipment
    • Max. Intel® Xeon® 16C and 128GB memory
    • PCIe Gen. 4 expansion
    • Small FF & Low profile

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